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CAT24C03
FEATURES
2-Kb I2C CMOS Serial EEPROM with Partial Array Write Protection DEVICE DESCRIPTION
The CAT24C03 is a 2-Kb Serial CMOS EEPROM, internally organized as 16 pages of 16 bytes each, for a total of 256 bytes of 8 bits each. It features a 16-byte page write buffer and supports both the Standard (100 kHz) as well as Fast (400 kHz) I2C protocol. Write operations can be inhibited by taking the WP pin High (this protects the upper half of the memory). The CAT24C03 is available in RoHS compliant "Green" and "Gold" 8-lead PDIP, SOIC, TSSOP and TDFN packages.
Supports Standard and Fast I2C Protocol 1.8 V to 5.5 V Supply Voltage Range 16-Byte Page Write Buffer Hardware Write Protection for upper half of
memory
Schmitt Triggers and Noise Suppression Filters
on I2C Bus Inputs (SCL and SDA).
Low power CMOS technology 1,000,000 program/erase cycles 100 year data retention RoHS compliant
" "&" " 8-pin PDIP, SOIC, TSSOP and TDFN packages
Industrial temperature range
PIN CONFIGURATION
PDIP (L) SOIC (W) TSSOP (Y) TDFN (VP2)
A0 A1 A2 VSS 1 2 3 4 8 7 6 5 VCC WP SCL SDA
FUNCTIONAL SYMBOL
VCC
SCL
A2, A1, A0
WP
CAT24C03
SDA
For the location of Pin 1, please consult the corresponding package drawing.
PIN FUNCTIONS
A0, A1, A2 SDA SCL WP VCC VSS Device Address Serial Data Serial Clock Write Protect Power Supply Ground
VSS
* Catalyst carries the I2C protocol under a license from the Philips Corporation.
(c) 2006 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
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Doc. No. 1113, Rev. A
CAT24C03
ABSOLUTE MAXIMUM RATINGS* Storage Temperature Voltage on Any Pin with Respect to Ground(1) -65C to +150C -0.5 V to +6.5 V
* Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability.
RELIABILITY CHARACTERISTICS(2) Symbol NEND(*) TDR Parameter Endurance Data Retention Min 1,000,000 100 Units Program/ Erase Cycles Years
(*) Page Mode, VCC = 5 V, 25C
D.C. OPERATING CHARACTERISTICS VCC = 1.8 V to 5.5 V, TA = -40C to 85C, unless otherwise specified. Symbol ICC ISB IL VIL VIH VOL1 VOL2 Parameter Supply Current Standby Current I/O Pin Leakage Input Low Voltage Input High Voltage Output Low Voltage Output Low Voltage VCC > 2.5 V, IOL = 3.0 mA VCC > 1.8 V, IOL = 1.0 mA Test Conditions Read or Write at 400 kHz All I/O Pins at GND or VCC Pin at GND or VCC -0.5 Min Max 1 2 2 VCC x 0.3 Units mA A A V V V V
VCC x 0.7 VCC + 0.5 0.4 0.2
PIN IMPEDANCE CHARACTERISTICS TA = 25C, f = 400 kHz, VCC = 5 V Symbol CIN(2) CIN(2) ZWPL ILWPH
Note: (1) The DC input voltage on any pin should not be lower than -0.5 V or higher than VCC + 0.5 V. During transitions, the voltage on any pin may undershoot to no less than -1.5 V or overshoot to no more than VCC + 1.5 V, for periods of less than 20 ns. (2) These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC-Q100 and JEDEC test methods.
Parameter SDA I/O Pin Capacitance Input Capacitance (other pins) WP Input Low Impedance WP Input High Leakage
Conditions VIN = 0 V VIN = 0 V VIN < 0.5 V VIN > VCC x 0.7
Min
Max 8 6
Units pF pF k A
5
70 2
Doc. No. 1113, Rev. A
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(c) 2006 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
CAT24C03
A.C. CHARACTERISTICS VCC = 1.8 V to 5.5 V, TA = -40C to 85C, unless otherwise specified. 1.8 V - 5.5 V Symbol FSCL TI(1) tAA(2) tBUF(1) tHD:STA tLOW tHIGH tSU:STA tHD:DAT tSU:DAT tR(1) tF(1) tSU:STO tDH tWR tPU(1), (3)
Note: (1) This parameter is tested initially and after a design or process change that affects the parameter. (2) For timing measurements the SDA line capacitance is ~ 100 pF; the SCL input is driven with rise and fall times of < 50 ns; the SDA I/O is pulled-up by a 3 mA current source; input driving signals swing from 20% to 80% of VCC. Output level reference levels are 30% and respectively 70% of VCC. (3) tPU is the delay required from the time VCC is stable until the device is ready to accept commands.
2.5 V - 5.5 V Min Max 400 0.1 0.9 1.3 0.6 1.3 0.6 0.6 0 0.1 Units kHz s s s s s s s s s 0.3 0.3 0.6 0.1 s s s s 5 1 ms ms
Parameter Clock Frequency Noise Suppression Time Constant at SCL, SDA Inputs SCL Low to SDA Data Out Time the Bus Must be Free Before a New Transmission Can Start Start Condition Hold Time Clock Low Period Clock High Period Start Condition Setup Time Data In Hold Time Data In Setup Time SDA and SCL Rise Time SDA and SCL Fall Time Stop Condition Setup Time Data Out Hold Time Write Cycle Time Power-up to Ready Mode
Min
Max 100 0.1 3.5
4.7 4 4.7 4 4.7 0 0.25 1 0.3 4 0.1 5 1
Power-On Reset (POR) The CAT24C03 incorporates Power-On Reset (POR) circuitry which protects the internal logic against powering up in the wrong state. The CAT24C03 will power up into Standby mode after VCC exceeds the POR trigger level and will power down into Reset mode when VCC drops below the POR trigger level. This bi-directional POR feature protects the device against `brown-out' failure following a temporary loss of power. The POR circuitry triggers at the minimum VCC level required for proper initialization of the internal state machines. The POR trigger level automatically tracks the internal CMOS device thresholds, and is naturally well below the minimum recommended VCC supply voltage.
(c) 2006 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
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Doc No. 1113, Rev. A
CAT24C03
PIN DESCRIPTION
SCL: The Serial Clock input pin accepts the Serial Clock generated by the Master. SDA: The Serial Data I/O pin receives input data and transmits data stored in EEPROM. In transmit mode, this pin is open drain. Data is acquired on the positive edge, and is delivered on the negative edge of SCL. A0, A1 and A2: The Address pins accept the device address. These pins have on-chip pull-down resistors. WP: The Write Protect input pin inhibits all write operations to the upper half of the memory array, when pulled HIGH. (locations 80H to FFH)This pin has an on-chip pull-down resistor.
START The START condition precedes all commands. It consists of a HIGH to LOW transition on SDA while SCL is HIGH. The START acts as a `wake-up' call to all receivers. Absent a START, a Slave will not respond to commands. STOP The STOP condition completes all commands. It consists of a LOW to HIGH transition on SDA while SCL is HIGH. The STOP starts the internal Write cycle (when following a Write command) or sends the Slave into standby mode (when following a Read command). Device Addressing The Master initiates data transfer by creating a START condition on the bus. The Master then broadcasts an 8-bit serial Slave address. The first 4 bits of the Slave address are set to 1010, for normal Read/Write operations (Figure 2). The next 3 bits, A2, A1 and A0, select one of 8 possible Slave devices. The last bit, R/W, specifies whether a Read (1) or Write (0) operation is to be performed. Acknowledge After processing the Slave address, the Slave responds with an acknowledge (ACK) by pulling down the SDA line during the 9th clock cycle (Figure 3). The Slave will also acknowledge the byte address and every data byte presented in Write mode. In Read mode the Slave shifts out a data byte, and then releases the SDA line during the 9th clock cycle. If the Master acknowledges the data, then the Slave continues transmitting. The Master terminates the session by not acknowledging the last data byte (NoACK) and by sending a STOP to the Slave. Bus timing is illustrated in Figure 4.
FUNCTIONAL DESCRIPTION
The CAT24C03 supports the Inter-Integrated Circuit (I2C) Bus data transmission protocol, which defines a device that sends data to the bus as a transmitter and a device receiving data as a receiver. Data flow is controlled by a Master device, which generates the serial clock and all START and STOP conditions. The CAT24C03 acts as a Slave device. Master and Slave alternate as either transmitter or receiver. Up to 8 devices may be connected to the bus as determined by the device address inputs A0, A1, and A2.
I2C BUS PROTOCOL
The I2C bus consists of two `wires', SCL and SDA. The two wires are connected to the VCC supply via pull-up resistors. Master and Slave devices connect to the 2wire bus via their respective SCL and SDA pins. The transmitting device pulls down the SDA line to `transmit' a `0' and releases it to `transmit' a `1'. Data transfer may be initiated only when the bus is not busy (see A.C. Characteristics). During data transfer, the SDA line must remain stable while the SCL line is HIGH. An SDA transition while SCL is HIGH will be interpreted as a START or STOP condition (Figure 1).
Doc. No. 1113, Rev. A
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(c) 2006 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
CAT24C03
Figure 1. Start/Stop Timing
SDA
SCL START BIT STOP BIT
Figure 2. Slave Address Bits
1
0
1
0
A2
A1
A0
R/W
DEVICE ADDRESS
Figure 3. Acknowledge Timing
SCL FROM MASTER 1
8 9
DATA OUTPUT FROM TRANSMITTER
DATA OUTPUT FROM RECEIVER
START
ACKNOWLEDGE
Figure 4. Bus Timing
tF tLOW
tHIGH
tLOW
tR
SCL
tSU:STA
tHD:STA
tHD:DAT
tSU:DAT
tSU:STO
SDA IN
tAA
tDH
tBUF
SDA OUT
(c) 2006 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
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Doc No. 1113, Rev. A
CAT24C03
WRITE OPERATIONS
Byte Write In Byte Write mode the Master sends a START, followed by Slave address, byte address and data to be written (Figure 5). The Slave acknowledges all 3 bytes, and the Master then follows up with a STOP, which in turn starts the internal Write operation (Figure 6). During internal Write, the Slave will not acknowledge any Read or Write request from the Master. Page Write The CAT24C03 contains 256 bytes of data, arranged in 16 pages of 16 bytes each. A page is selected by the 4 most significant bits of the address byte following the Slave address, while the 4 least significant bits point to the byte within the page. Up to 16 bytes can be written in one Write cycle (Figure 7). The internal byte address counter is automatically incremented after each data byte is loaded. If the Master transmits more than 16 data bytes, then earlier bytes will be overwritten by later bytes in a `wrap-around' fashion (within the selected page). The internal Write cycle starts immediately following the STOP. Acknowledge Polling Acknowledge polling can be used to determine if the CAT24C03 is busy writing or is ready to accept commands. Polling is implemented by interrogating the device with a `Selective Read' command (see READ OPERATIONS). The CAT24C03 will not acknowledge the Slave address, as long as internal Write is in progress. Hardware Write Protection With the WP pin held HIGH, the entire memory is protected against Write operations. If the WP pin is left floating or is grounded, it has no impact on the operation of the CAT24C03.
Doc. No. 1113, Rev. A
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(c) 2006 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
CAT24C03
Figure 5. Byte Write Timing
BUS ACTIVITY: MASTER SDA LINE
S T A R T
SLAVE ADDRESS
BYTE ADDRESS
DATA
S T O P P
S A C K A C K
A C K
Figure 6. Write Cycle Timing
SCL
SDA
8th Bit Byte n
ACK
tWR STOP CONDITION
START CONDITION ADDRESS
Figure 7. Page Write Timing
BUS ACTIVITY: MASTER SDA LINE
S T A R T
S
SLAVE ADDRESS
BYTE ADDRESS (n)
DATA n
DATA n+1
DATA n+P
S T O P
P
A C K A C K
A C K
A C K
A C K
NOTE: IN THIS EXAMPLE n = XXXX 0000(B); X = 1 or 0
(c) 2006 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
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Doc No. 1113, Rev. A
CAT24C03
READ OPERATIONS
Immediate Address Read In standby mode, the CAT24C03 internal address counter points to the data byte immediately following the last byte accessed by a previous operation. If that `previous' byte was the last byte in memory, then the address counter will point to the 1st memory byte, etc. When, following a START, the CAT24C03 is presented with a Slave address containing a `1' in the R/W bit position (Figure 8), it will acknowledge (ACK) in the 9th clock cycle, and will then transmit data being pointed at by the internal address counter. The Master can stop further transmission by issuing a NoACK, followed by a STOP condition. Selective Read The Read operation can also be started at an address different from the one stored in the internal address counter. The address counter can be initialized by performing a `dummy' Write operation (Figure 9). Here the START is followed by the Slave address (with the R/W bit set to `0') and the desired byte address. Instead of following up with data, the Master then issues a 2nd START, followed by the `Immediate Address Read' sequence, as described earlier. Sequential Read If the Master acknowledges the 1st data byte transmitted by the CAT24C03, then the device will continue transmitting as long as each data byte is acknowledged by the Master (Figure 10). If the end of memory is reached during sequential Read, then the address counter will `wrap-around' to the beginning of memory, etc. Sequential Read works with either `Immediate Address Read' or `Selective Read', the only difference being the starting byte address.
Doc. No. 1113, Rev. A
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(c) 2006 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
CAT24C03
Figure 8. Immediate Address Read Timing
S T A R T
BUS ACTIVITY: MASTER SDA LINE
SLAVE ADDRESS
S T O P P
S A C K
DATA N O A C K
SCL
8
9
SDA
8th Bit DATA OUT NO ACK STOP
Figure 9. Selective Read Timing
BUS ACTIVITY: MASTER SDA LINE
S T A R T
S
SLAVE ADDRESS
BYTE ADDRESS (n)
S T A R T
S
SLAVE ADDRESS
S T O P P
A C K
A C K
A C K
DATA n
N O A C K
Figure 10. Sequential Read Timing
BUS ACTIVITY: MASTER SDA LINE
SLAVE ADDRESS
DATA n
DATA n+1
DATA n+2
DATA n+x
S T O P
P
A C K
A C K
A C K
A C K
N O A C K
(c) 2006 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
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Doc No. 1113, Rev. A
CAT24C03
8-LEAD 300 MIL WIDE PLASTIC DIP (L)
E1
D
E
A2
A
A1
L
e b2 b
eB
SYMBOL A A1 A2 b b2 D D2 E E1 e eB L
MIN 0.120 0.015 0.115 0.014 0.045 0.355 0.300 0.300 0.240
NOM
MAX 0.210
0.130 0.018 0.060 0.365 0.310 0.250 0.100 BSC 0.130
0.195 0.022 0.070 0.400 0.325 0.325 0.280 0.430 0.150
0.115
Notes: 1. Complies with JEDEC Standard MS001. 2. All dimensions are in inches. 3. Dimensioning and tolerancing per ANSI Y14.5M-1982
Doc. No. 1113, Rev. A
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(c) 2006 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
CAT24C03
8-LEAD 150 MIL WIDE SOIC (W)
E1 E
D C A 1 e b A1 L
SYMBOL A1 A2 b C D E E1 e f 1
MIN 0.0040 0.0532 0.013 0.0075 0.1890 02284 0.149
NOM
MAX 0.0098 0.0688 0.020 0.0098 0.1968 0.2440 0.1574
0.050 BSC 0.0099 0 0.0196 8
Notes: 1. Complies with JEDEC specification MS-012 dimensions. 2. All linear dimensions in millimeters.
(c) 2006 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
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Doc No. 1113, Rev. A
CAT24C03
8-LEAD TSSOP (Y)
D
8 5
SEE DETAIL A
c E E1
E/2
1
4
GAGE PLANE
PIN #1 IDENT. 1 A2 L 0.25 SEATING PLANE SEE DETAIL A A
e b
A1
SYMBOL A A1 A2 b c D E E1 e L 1
MIN 0.05 0.80 0.19 0.09 2.90 6.30 4.30 0.50 0.00
NOM
MAX 1.20 0.15 1.05 0.30 0.20 3.10 6.50 4.50 0.75 8.00
0.90
3.00 6.4 4.40 0.65 BSC 0.60
Notes: 1. All dimensions in millimeters.
Doc. No. 1113, Rev. A
12
(c) 2006 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
CAT24C03
8-PAD TDFN 2X3 PACKAGE (VP2)
A
E
PIN 1 INDEX AREA
D
A1
A2
A3
D2
SYMBOL A A1 A2 A3 b D D2 E E2 e L
MIN 0.70 0.00 0.45 0.20 1.90 1.30 2.90 1.20 0.20
NOM 0.75 0.02 0.55 0.20 REF 0.25 2.00 1.40 3.00 1.30 0.50 TYP 0.30
MAX 0.80 0.05 0.65 0.30 2.10 1.50 3.10 1.40 0.40
b e
3xe
E2
PIN 1 ID
L
NOTE: 1. ALL DIMENSIONS IN MM. ANGLES IN DEGREES. 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMNALS. COPLANARITY SHALL NOT EXCEED 0.08 mm. 3. WARPAGE SHALL NOT EXCEED 0.10 mm. 4. PACKAGE LENGTH / PACKAGE WIDTH ARE CONSIDERED AS SPECIAL CHARACTERISTIC. 5. REFER JEDEC MO-229.
(c) 2006 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
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Doc No. 1113, Rev. A
CAT24C03
ORDERING INFORMATION
Prefix
CAT
Device # 24C03 Y
Suffix I - GT3
Company ID
Product Number
Temperature Range I = Industrial (-40C to +85C)
Package L: PDIP (Lead-free, Halogen-free) W: SOIC, JEDEC (Lead-free, Halogen-free) Y: TSSOP (Lead-free, Halogen-free) VP2: TDFN (Lead-free, Halogen-free)
Notes:
Lead Finish/Tape & Reel G: NiPdAu Lead Plating T: Tape & Reel 3: 3000/Reel
(1) The device used in the above example is a CAT24C03YI-GT3 (TSSOP, Industrial Temperature, 1.8 Volt to 5.5 Volt Operating Voltage, Tape & Reel) (2) For additional package and temperature options, please contact your nearest Catalyst Semiconductor sales office.
Doc. No. 1113, Rev. A
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(c) 2006 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
CAT24C03
PACKAGE MARKING
8-Lead PDIP 8-Lead SOIC
24C03LI YYWWG
24C03WI YYWWG
CSI 24C03L I YY WW G
= Catalyst Semiconductor, Inc. = Device Code = Temperature Range = Production Year = Production Week = Product Revision
CSI 24C03W I YY WW G
= Catalyst Semiconductor, Inc. = Device Code = Temperature Range = Production Year = Production Week = Product Revision
8-Lead TSSOP
8-Lead TDFN
YMG 24C03I
EMN NNN YM
Y M G 24C03 I
Notes:
= Production Year = Production Month = Die Revision = Device Code = Industrial Temperature Range
E M = Device Code N = Traceability Code Y = Production Year M = Production Month
(1) The circle on the package marking indicates the location of Pin 1.
(c) 2006 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
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Doc No. 1113, Rev. A
CAT24C03
TAPE AND REEL
Direction of Feed Device Orientation
SPROKET HOLE
TOP COVER TAPE THICKNESS (t1) 0.10mm (0.004) MAX THICK EMBOSSED CARRIER EMBOSSMENT
DEVICE ORIENTATION PIN 1 PIN 1 PIN 1
TDFN
SOIC
TSSOP
Reel Dimensions(1)
40mm (1.575) MIN. ACCESS HOLE AT SLOT LOCATION B*
T
A
D*
C
N
FULL RADIUS*
TAPE SLOT IN CORE FOR TAPE START. 2.5mm (0.098) MIN WIDTH 10mm (0.394) MIN DEPTH G (MEASURED AT HUB)
* DRIVE SPOKES OPTIONAL, IF USED ASTERISKED DIMENSIONS APPLY.
Embossed Carrier Dimensions Tape Size 8MM 12MM A Max 330 (13.00) Qty/Reel 3000 B Min 1.5 (0.059) C 12.80 (0.504) 13.20 (0.5200) D* Min 20.2 (0.795) N Min 50 (1.969) G 8.4 (0.328) 9.9 (1.389) 12.4 (0.488) 14.4 (0.558) T Max 14.4 (0.566) 18.4 (0.724)
Embossed Carrier Dimensions Component 8L SOIC 8L TDFN 2x3mm Package Type W, Y VP2 Tape Size (W) 12mm 8mm Part Pitch (P) 8mm 4mm
Note: (1) Metric dimensions will govern; English measurements rounded, for reference only and in parentheses.
(c) 2006 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
Doc. No. 1113, Rev. A
16
CAT24C03
Embossed Carrier Dimensions (12 Tape Only)
10 PITCHES CUMULATIVE TOLERANCE ON TAPE 0.2mm( 0.008) P2 TOP COVER TAPE (2) A0 B1 (2) K0 B0 E
K T
D
P0
F
W
P EMBOSSMENT FOR MACHINE REFERENCE ONLY INCLUDING DRAFT AND RADII CONCENTRIC ABOUT B0
CENTER LINES OF CAVITY
D1 FOR COMPONENTS 2.0mm X 1.2mm AND LARGER
USER DIRECTION OF FEED
Embossed Tape--Constant Dimensions (1) Tape Sizes 12mm D 1.5 (0.059) 1.6 (0.063) E 1.65 (0.065) 1.85 (0.073) P0 3.9 (0.153) 4.1 (0.161) T Max. 400 (0.016) D1 Min. 1.5 (0.059) A0 B0 K0(2)
Embossed Carrier Dimensions (12 Tape Only) Tape Sizes 12mm B1 Max. 8.2 (0.0323) F 5.45 (0.0215) 5.55 (0.219) K Max. 4.5 (0.177) P2 1.95 (0.077) 2.05 (0.081) R Min. 30 (1.181) W 11.7 (0.460) 12.3 (0.484) P 7.9 (0.275) 8.1 (0.355)
Note: (1) Metric dimensions will govern; English measurements rounded, for reference only and in parentheses. (2) A0 B0 K0 are determined by component size. The clearance between the component and the cavity must be within 0.05 (0.002) min. to 0.65 (0.026) max. for 12mm tape, 0.05 (0.002) min. to 0.90 (0.035) max. for 16mm tape, and 0.05 (0.002) min. to 1.00 (0.039) max. for 24mm tape and larger. The component cannot rotate more than 20 within the determined cavity, see Component Rotation.
(c) 2006 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
17
Doc No. 1113, Rev. A
CAT24C03
REVISION HISTORY
Date 03/08/06 Revision Comments A Initial Issue
Doc. No. 1113, Rev. A
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(c) 2006 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
CAT24C03
Copyrights, Trademarks and Patents Trademarks and registered trademarks of Catalyst Semiconductor include each of the following: DPP TM AE2 TM MiniPotTM
Catalyst Semiconductor has been issued U.S. and foreign patents and has patent applications pending that protect its products. CATALYST SEMICONDUCTOR MAKES NO WARRANTY, REPRESENTATION OR GUARANTEE, EXPRESS OR IMPLIED, REGARDING THE SUITABILITY OF ITS PRODUCTS FOR ANY PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE RIGHTS OF THIRD PARTIES WITH RESPECT TO ANY PARTICULAR USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANY AND ALL LIABILITY ARISING OUT OF ANY SUCH USE OR APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES. Catalyst Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Catalyst Semiconductor product could create a situation where personal injury or death may occur. Catalyst Semiconductor reserves the right to make changes to or discontinue any product or service described herein without notice. Products with data sheets labeled "Advance Information" or "Preliminary" and other products described herein may not be in production or offered for sale. Catalyst Semiconductor advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate typical semiconductor applications and may not be complete.
(c) 2006 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
19
Doc No. 1113, Rev. A
Catalyst Semiconductor, Inc. Corporate Headquarters 1250 Borregas Avenue Sunnyvale, CA 94089 Phone: 408.542.1000 Fax: 408.542.1200 www.catsemi.com
Publication #: Revison: Issue date:
1113 A 03/08/06

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